半导体器件综合 -环标网

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标准编号	标准名称	发布部门	发布日期	状态
I.S. EN 60749-28:2017	Semiconductor Devices - Mechanical and Climatic Test Methods Part 28: Electrostatic Discharge (esd) Sensitivity Testing - Charged Device Model (cdm) - Device Level	National S..	2017-07-18	现行
I.S. EN 60749-3:2017	Semiconductor Devices - Mechanical and Climatic Test Methods Part 3: External Visual Examination	National S..	2017-07-04	现行
I.S. EN 60749-6:2017	Semiconductor Devices - Mechanical and Climatic Test Methods Part 6: Storage at High Temperature	National S..	2017-07-04	现行
I.S. EN 60749-9:2017	Semiconductor Devices - Mechanical and Climatic Test Methods Part 9: Permanence of Marking	National S..	2017-07-04	现行
I.S. EN 60749-4:2017	Semiconductor Devices - Mechanical and Climatic Test Methods Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (hast)	National S..	2017-07-04	现行
KS C IEC 60749-34:2017	Semiconductor devices - Mechanical and climatic test methods - Part 34:Power cycling	Korean Sta..	2017-05-30	废止
IEC 60749-5 Ed. 2.0	Semiconductor devices - Mechanical and climatic test methods Part 5: Steady-state temperature humidity bias life test	Internatio..	2017-04-10	现行
DIN EN 60749-41 (2017-04)	Semiconductor devices - Mechanical and climatic test methods Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016)	German Ins..	2017-04-01	现行
DIN EN 60749-44 (2017-04)	Semiconductor Devices - Mechanical And Climatic Test Methods - Part 44: Neutron Beam Irradiated Single Event Effect (see) Test Method For Semiconductor Devices (iec 60749-44:2016)	German Ins..	2017-04-01	现行
IEC 60749-28 Ed. 1.0	Semiconductor devices - Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level	Internatio..	2017-03-28	现行
IEC 60749-9 Ed. 2.0	Semiconductor devices - Mechanical and climatic test methods Part 9: Permanence of marking	Internatio..	2017-03-03	现行
IEC 60749-3 Ed. 2.0	Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination	Internatio..	2017-03-03	现行
IEC 60749-4 Ed. 2.0	Semiconductor devices - Mechanical and climatic test methods Part 4: Damp heat, steady state, highly accelerated stress test (HAST)	Internatio..	2017-03-03	现行
IEC 60749-6 Ed. 2.0	Semiconductor devices - Mechanical and climatic test methods Part 6: Storage at high temperature	Internatio..	2017-03-03	现行
DIN EN 62779-3 (2017-03)	Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 3: Functional Type And Its Operational Conditions (iec 62779-3:2016)	Verband De..	2017-03-01	现行
DIN EN 62779-1 (2017-01)	Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 1: General Requirements (iec 62779-1:2016)	Verband De..	2017-01-01	现行
DIN EN 62779-2 (2017-01)	Semiconductor Devices - Semiconductor Interface For Human Body Communication - Part 2: Characterization Of Interfacing Performances (iec 62779-2:2016)	Verband De..	2017-01-01	现行
KS C IEC 60749-42:2016	Semiconductor devices ― Mechanical and climatic test methods ― Part 42: Temperature and humidity storage	Korean Sta..	2016-12-29	废止
I.S. EN 60191-6-13:2016	Mechanical Standardization of Semiconductor Devices Part 6-13: Design Guideline of Open-top-type Sockets for Fine-pitch Ball Grid Array (fbga) and Fine-pitch Land Grid Array (flga)	National S..	2016-12-13	现行
DIN EN 62047-1 (2016-12)	Semiconductor Devices - Micro-electromechanical Devices - Part 1: Terms And Definitions (iec 62047-1:2016)	German Ins..	2016-12-01	现行

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