I.S. EN 60749-19:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods Part 19: Die Shear Strength
出版：National Standards Authority of Ireland
专家解读视频
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term 'semiconductor die' should be taken to include passive elements).
EN 60749-19:2003 - Identical
DIN EN 60749-19 : 2011 - Identical
NF EN 60749-19 : 2003 AMD 1 2011 - Identical
EN 60749-19 : 2003 AMD 1 2010 - Identical
UNE EN 60749-19 : 2003 - Identical
BS EN 60749-19 : 2003 - Identical
DIN EN 60749-19 : 2011 - Identical
BS EN 60749-19 : 2003 - Identical
SN EN 60749-19 : 2003 - Identical
IEC 60749-19 : 1.1 - Identical
NBN EN 60749-19 : 2004 AMD 1 2010 - Identical
SS EN 60749-19:2003 - Identical
SN EN 60749-19:2003 - Identical
BS EN 60749-19:2003+A1:2010 - Identical
DIN EN 60749-19 (2003-10) - Identical
NBN EN 60749-19:2004 - Identical
NF EN 60749-19:2003 - Identical
IEC 60749-19 Ed. 1.0 - Identical
SS EN 60749-19 Ed. 1 (2003) - Identical
UNE EN 60749-19:2003 - Identical
