IEC 60749-19 Ed. 1.0现行
Semiconductor devices - Mechanical and climatic test methods Part 19: Die shear strength
出版：International Electrotechnical Committee
专家解读视频
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
BS EN 60749-19:2003+A1:2010 - Identical
CEI EN 60749-19 Ed. 1 (2004) - Identical
SN EN 60749-19:2003 - Identical
I.S. EN 60749-19:2003 - Identical
DIN EN 60749-19 (2003-10) - Identical
NF EN 60749-19:2003 - Identical
PN EN 60749-19:2005 - Identical
SS EN 60749-19 Ed. 1 (2003) - Identical
EN 60749-19:2003 - Identical
NEN EN IEC 60749-19:2003 - Identical
OVE/ONORM EN 60749-19:2003 - Identical
