BS EN 60749-19 : 2003现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
出版：British Standards Institution
专家解读视频
Specifies the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term "semiconductor die" should be taken to include passive elements). It also applicable to cavity packages or as a process monitor.
DIN EN 60749-19 : 2011 - Identical
I.S. EN 60749-19:2003 - Identical
I.S. EN 60749-19:2003 - Identical
SN EN 60749-19 : 2003 - Identical
IEC 60749-19 : 1.1 - Identical
NBN EN 60749-19 : 2004 AMD 1 2010 - Identical
UNE EN 60749-19 : 2003 - Identical
EN 60749-19 : 2003 AMD 1 2010 - Identical
NF EN 60749-19 : 2003 AMD 1 2011 - Identical
DIN EN 60749-19 : 2011 - Identical
