其他半导体器件 -环标网

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标准编号	标准名称	发布部门	发布日期	状态
IEC 62031 Ed. 2.0	LED modules for general lighting - Safety specifications	Internatio..	2018-03-08	现行
I.S. EN IEC 62969-1:2018	Semiconductor Devices - Semiconductor Interface for Automotive Vehicles Part 1: General Requirements of Power Interface for Automotive Vehicle Sensors	National S..	2018-03-06	现行
IEC 62047-29 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature	Internatio..	2017-11-22	现行
IEC 60747-16-4 Amd.2 Ed. 1.0	Amendment 2 - Semiconductor devices Part 16-4: Microwave integrated circuits - Switches	Internatio..	2017-08-16	现行
IEC 60747-16-3 Amd.2 Ed. 1.0	Amendment 2 - Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters	Internatio..	2017-08-16	现行
IEC 60747-16-4 Ed. 1.2	Semiconductor devices Part 16-4: Microwave integrated circuits - Switches	Internatio..	2017-08-16	现行
IEC 60747-16-3 Ed. 1.2	Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters	Internatio..	2017-08-16	现行
DIN EN 60747-16-6 (2017-08)	Semiconductor Devices - Part 16-6: Microwave Integrated Circuits - Frequency Multipliers (iec 47e/568/cd:2017)	German Ins..	2017-08-01	现行
IEC 62951-1 Ed. 1.0	Semiconductor devices - Flexible and stretchable semiconductor devices Part 1: Bending test method for conductive thin films on flexible substrates	Internatio..	2017-04-10	现行
JIS C 5630-1:2017	Semiconductor Devices - Micro-electromechanical Devices - Part 1: Terms And Definitions	Japanese S..	2017-03-21	现行
IEC 60747-16-1 Ed. 1.2	Semiconductor devices Part 16-1: Microwave integrated circuits - Amplifiers	Internatio..	2017-02-15	现行
IEC 60747-16-1 Amd.2 Ed. 1.0	Amendment 2 - Semiconductor devices Part 16-1: Microwave integrated circuits - Amplifiers	Internatio..	2017-02-15	现行
IEC 62047-27 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)	Internatio..	2017-01-20	现行
IEC 62047-28 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices	Internatio..	2017-01-20	现行
KS C IEC 62047-18:2016	Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials	Korean Sta..	2016-12-29	废止
KS C IEC 62047-22:2016	Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials	Korean Sta..	2016-12-29	废止
I.S. EN 62047-25:2016	Semiconductor Devices - Micro-electromechanical Devices Part 25: Silicon Based Mems Fabrication Technology - Measurement Method of Pull-press and Shearing Strength of Micro Bonding Area	National S..	2016-12-06	现行
IEC 62047-25 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area	Internatio..	2016-08-29	现行
I.S. EN 62047-26:2016	Semiconductor Devices - Micro-electromechanical Devices Part 26: Description and Measurement Methods for Micro Trench and Needle Structures	National S..	2016-05-10	现行
I.S. EN 62047-1:2016	Semiconductor Devices - Micro-electromechanical Devices Part 1: Terms and Definitions	National S..	2016-04-26	现行

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