IEC 62047-25 Ed. 1.0现行
Semiconductor devices - Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
出版：International Electrotechnical Committee
专家解读视频
基本信息
标准编号： IEC 62047-25 Ed. 1.0
发布时间：2016/8/29 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：45
标准简介
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
