其他半导体器件 -环标网

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标准编号	标准名称	发布部门	发布日期	状态
JIS C 6790:2016	Load Test Of A Bolt-clamped Langevin Vibrator Using Wattmeter Method	Japanese S..	2016-03-22	现行
IEC 60747-5-7 Ed. 1.0	Semiconductor devices Part 5-7: Optoelectronic devices - Photodiodes and phototransistors	Internatio..	2016-02-23	现行
IEC 60747-5-6 Ed. 1.0	Semiconductor devices Part 5-6: Optoelectronic devices - Light emitting diodes	Internatio..	2016-02-23	现行
IEC 62047-26 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 26: Description and measurement methods for micro trench and needle structures	Internatio..	2016-01-07	现行
IEC 62047-1 Ed. 2.0	Semiconductor devices - Micro-electromechanical devices Part 1: Terms and definitions	Internatio..	2016-01-06	现行
KS C IEC 62047-8:2015	Semiconductor devices ? Micro-electromechanical devices ? Part 8: Strip bending test method for tensile property measurement of thin films	Korean Sta..	2015-12-30	现行
KS C IEC 62047-5:2015	Semiconductor devices - MEMS devices - Part 5: RF MEMS switches	Korean Sta..	2015-12-30	现行
KS C IEC 62047-7:2015	SEMICONDUCTOR DEVICES ? MICRO-ELECTROMECHANICAL DEVICES ? Part 7: MEMS BAW filter and duplexer for radio frequency control and selection	Korean Sta..	2015-12-30	现行
JIS C 5630-20:2015	Semiconductor Devices - Micro-electromechanical Devices - Part 20: Gyroscopes	Japanese S..	2015-11-20	现行
JIS C 8153:2015	Dc Or Ac Supplied Electronic Control Gear For Led Modules - Performance Requirements	Japanese S..	2015-10-20	现行
JIS C 8154:2015	Led Modules For General Lighting - Safety Specifications	Japanese S..	2015-10-20	现行
I.S. EN 62047-15:2015	Semiconductor Devices - Micro-electromechanical Devices Part 15: Test Method of Bonding Strength Between Pdms and Glass	National S..	2015-07-28	现行
I.S. EN 62047-17:2015	Semiconductor Devices - Micro-electromechanical Devices Part 17: Bulge Test Method for Measuring Mechanical Properties of Thin Films	National S..	2015-07-28	现行
I.S. EN 62047-16:2015	Semiconductor Devices - Micro-electromechanical Devices Part 16: Test Methods for Determining Residual Stresses of Mems Films - Wafer Curvature and Cantilever Beam Deflection Methods	National S..	2015-07-28	现行
OVE/ONORM EN 62477-1:2013	Safety Requirements For Power Electronic Converter Systems And Equipment - Part 1: General (Iec 62477-1:2012)	Osterreich..	2015-06-01	被替代
OVE/ONORM EN 62047-21:2015	Semiconductor Devices - Micro-Electromechanical Devices - Part 21: Test Method For Poisson's Ratio Of Thin Film Mems Materials (Iec 62047-21:2014)	Osterreich..	2015-06-01	现行
OVE/ONORM EN 62047-20:2015	Semiconductor Devices - Micro-Electromechanical Devices - Part 20: Gyroscopes (Iec 62047-20:2014)	Osterreich..	2015-06-01	现行
VDE 0558-477-1:2013	Safety Requirements For Power Electronic Converter Systems And Equipment - Part 1: General (Iec 62477-1:2012)	Verband De..	2015-05-01	被替代
IEC 62047-17 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films	Internatio..	2015-03-05	现行
IEC 62047-15 Ed. 1.0	Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass	Internatio..	2015-03-05	现行

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