UNE EN 60749-20:2004被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic-encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版：Asociacion Espanola de Normalizacion
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
BS EN 60749-20 : 2009 - Identical
DIN EN 60749-20 : 2010 - Identical
IEC 60749-20 : 2.0 - Identical
NBN EN 60749-20 : 2010 - Identical
EN 60749-20 : 2009 - Identical
NF EN 60749-20 : 2010 - Identical
I.S. EN 60749-20:2009 - Identical
I.S. EN 60749-20:2009 - Identical
BS EN 60749-20 : 2009 - Identical
DIN EN 60749-20 : 2010 - Identical
SS EN 60749-20 Ed. 2 (2010) - Identical
NBN EN 60749-20:2010 - Identical
BS EN 60749-20:2009 - Identical
NF EN 60749-20:2010 - Identical
DIN EN 60749-20 (2010-04) - Identical
I.S. EN 60749-20:2009 - Identical
EN 60749-20:2009 - Identical
BS EN 60749-20:2003 - Identical
DIN EN 60749-20 (2003-12) - Identical
NBN EN 60749-20:2004 - Identical
NF EN 60749-20:2003 - Identical
I.S. EN 60749-20:2003 - Identical
IEC 60749-20 Ed. 1.0 - Identical
SS EN 60749-20 Ed. 1 (2003) - Identical
