I.S. EN 60749-20:2009现行
Semiconductor Devices - Mechanical and Climatic Test Methods Part 20: Resistance of Plastic Encapsulated Smds to the Combined Effect of Moisture and Soldering Heat
出版：National Standards Authority of Ireland
专家解读视频
Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
NF EN 60749-20:2010 - Identical
BS EN 60749-20:2009 - Identical
NBN EN 60749-20:2010 - Identical
EN 60749-20:2009 - Identical
UNE EN 60749-20:2004 - Identical
SS EN 60749-20 Ed. 2 (2010) - Identical
BS EN 60749-20 : 2009 - Identical
IEC 60749-20 : 2.0 - Identical
UNE EN 60749-20 : 2004 - Identical
DIN EN 60749-20 : 2010 - Identical
NBN EN 60749-20 : 2010 - Identical
EN 60749-20 : 2009 - Identical
NF EN 60749-20 : 2010 - Identical
DIN EN 60749-20 : 2010 - Identical
BS EN 60749-20 : 2009 - Identical
UNE EN 60749-20 : 2004 - Identical
