IEC 60749-20 Ed. 1.0被替代
Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
出版：International Electrotechnical Committee
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.
CEI EN 60749-20 Ed. 1 (2004) - Identical
OVE/ONORM EN 60749-20:2004 - Identical
NEN EN IEC 60749-20:2003 - Identical
I.S. EN 60749-20:2003 - Identical
PN EN 60749-20:2005 - Identical
SS EN 60749-20 Ed. 1 (2003) - Identical
UNE EN 60749-20:2004 - Identical
BS EN 60749-20:2003 - Identical
DIN EN 60749-20 (2003-12) - Identical
NF EN 60749-20:2003 - Identical
