BS EN 60749-20:2009现行
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
出版：British Standards Institution
专家解读视频
Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
© British Standards Institution 2013
EN 60749-20:2009 - Identical
I.S. EN 60749-20:2009 - Identical
NF EN 60749-20:2010 - Identical
NBN EN 60749-20:2010 - Identical
SS EN 60749-20 Ed. 2 (2010) - Identical
DIN EN 60749-20 (2010-04) - Identical
UNE EN 60749-20 : 2004 - Identical
I.S. EN 60749-20:2009 - Identical
DIN EN 60749-20 : 2010 - Identical
I.S. EN 60749-20:2009 - Identical
NF EN 60749-20 : 2010 - Identical
EN 60749-20 : 2009 - Identical
NBN EN 60749-20 : 2010 - Identical
DIN EN 60749-20 : 2010 - Identical
UNE EN 60749-20 : 2004 - Identical
IEC 60749-20 : 2.0 - Identical
IEC 60749-20 Ed. 2.0 - Identical
UNE EN 60749-20:2004 - Identical
