DIN EN 60749-20 (2003-12)被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic-encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
Supersedes DIN EN 60749 (06/2005) DRAFT 2007 issued in Oct. 2007. (10/2007)
UNE EN 60749-20:2004 - Identical
SS EN 60749-20 Ed. 1 (2003) - Identical
IEC 60749-20 Ed. 1.0 - Identical
I.S. EN 60749-20:2003 - Identical
NF EN 60749-20:2003 - Identical
NBN EN 60749-20:2004 - Identical
BS EN 60749-20:2003 - Identical
