IEC 60749-20 : 2.0现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
出版：International Electrotechnical Committee
专家解读视频
Describes a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
DIN EN 60749-20 : 2010 - Identical
NEN EN IEC 60749-20 : 2009 - Identical
PN EN 60749-20 : 2010 - Identical
CEI EN 60749-20 : 2010 - Identical
DS EN 60749-20 : 2009 - Identical
BS EN 60749-20 : 2009 - Identical
UNE EN 60749-20 : 2004 - Identical
I.S. EN 60749-20:2009 - Identical
DS EN 60749-20 : 2009 - Identical
NF EN 60749-20 : 2010 - Identical
