DIN EN 60749-20 (2010-04)现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic Encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
Supersedes DIN EN 60749. (06/2005)
SS EN 60749-20 Ed. 2 (2010) - Identical
UNE EN 60749-20:2004 - Identical
EN 60749-20:2009 - Identical
NBN EN 60749-20:2010 - Identical
BS EN 60749-20:2009 - Identical
NF EN 60749-20:2010 - Identical
