NEN EN IEC 60749-19:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 19: Die Shear Strength
出版：Nederlands Normalisatie Instituut
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基本信息
标准编号： NEN EN IEC 60749-19:2003
发布时间：2003/8/1 0:00:00
标准类别：Standard
出版单位：Nederlands Normalisatie Instituut
标准页数：12
标准简介
Determines the integrity of materials and procedures used to attach semiconductor die to packaging headers or other substrates generally only applicable to cavity packages or as a process monitor.
