IEC 60749-19 Ed. 1.1现行
Semiconductor devices - Mechanical and climatic test methods Part 19: Die shear strength
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60749-19 Ed. 1.1
发布时间：2010/11/29 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：13
标准简介
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
本标准替代的旧标准
