
Semiconductor devices - Mechanical and climatic test methods Part 32: Flammability of plastic-encapsulated devices (externally induced)
出版:International Electrotechnical Committee

专家解读视频
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
BS EN 60749-32:2003+A1:2010 - Identical
CEI EN 60749-32 Ed. 1 (2004) - Identical
SN EN 60749-32:2003 - Identical
BS EN 60749-32:2003 - Identical
DIN EN 60749-32 (2003-12) - Identical
NF EN 60749-32:2003 - Identical
I.S. EN 60749-32:2003 - Identical
PN EN 60749-32:2005 - Identical
SS EN 60749-32 Ed. 1 (2003) - Identical
UNE EN 60749-32:2004 - Identical
EN 60749-32:2003 - Identical
NEN EN IEC 60749-32:2003 - Identical
OVE/ONORM EN 60749-32:2004 - Identical