IEC 60749-35 Ed. 1.0现行
Semiconductor devices - Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
出版：International Electrotechnical Committee
专家解读视频
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
PN EN 60749-35:2006 - Identical
I.S. EN 60749-35:2006 - Identical
NF EN 60749-35:2006 - Identical
DIN EN 60749-35 (2007-03) - Identical
BS EN 60749-35:2006 - Identical
SS EN 60749-35 Ed. 1 (2006) - Identical
NEN EN IEC 60749-35:2006 - Identical
EN 60749-35:2006 - Identical
OVE/ONORM EN 60749-35:2007 - Identical
