
Semiconductor Devices - Mechanical and Climatic Test Methods Part 35: Acoustic Microscopy for Plastic Encapsulated Electronic Components
出版:National Standards Authority of Ireland

专家解读视频
Describes the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
NBN EN 60749-35 : 2007 - Identical
BS EN 60749-35 : 2006 - Identical
EN 60749-35 : 2006 - Identical
DIN EN 60749-35 : 2007 - Identical
IEC 60749-35 : 1.0 - Identical
NF EN 60749-35 : 2006 - Identical
BS EN 60749-35 : 2006 - Identical
DIN EN 60749-35 : 2007 - Identical
DIN EN 60749-35 (2007-03) - Identical
NBN EN 60749-35:2007 - Identical
NF EN 60749-35:2006 - Identical
IEC 60749-35 Ed. 1.0 - Identical
SS EN 60749-35 Ed. 1 (2006) - Identical
BS EN 60749-35:2006 - Identical
EN 60749-35:2006 - Identical