
Semiconductor devices - Mechanical and climatic test methods Part 2: Low air pressure
出版:International Electrotechnical Committee

专家解读视频
Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.
DIN EN 60749-2 (2003-04) - Identical
UNE EN 60749-2:2003 - Identical
CEI EN 60749-2 Ed. 1 (2004) - Identical
BS EN 60749-2:2002 - Identical
NF EN 60749-2:2002 - Identical
I.S. EN 60749-2:2002 - Identical
PN EN 60749-2:2004 - Identical
SS EN 60749-2 Ed. 1 (2003) - Identical
NEN EN IEC 60749-2:2002 - Identical
OVE/ONORM EN 60749-2:2003 - Identical