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IEC 60068-2-58 Ed. 3.0被替代

Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

出版：International Electrotechnical Committee

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基本信息

标准编号： IEC 60068-2-58 Ed. 3.0

发布时间：2004/7/15 0:00:00

标准类别：Standard

出版单位：International Electrotechnical Committee

标准页数：24

标准简介

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

本标准替代的旧标准

IEC 60068-2-58 Ed. 2.0

替代本标准的新标准

IEC 60068-2-58 Ed. 4.0

等同采用的国际标准

PN EN 60068-2-58:2007 - Identical

I.S. EN 60068-2-58:2004 - Identical

NBN EN 60068 2-58:2006 - Identical

NF EN 60068-2-58:2005 - Identical

OVE/ONORM EN 60068-2-58:2005 - Identical

DIN EN 60068-2-58 (2005-03) - Identical

BS EN 60068-2-58:2004 - Identical