NEN EN IEC 60068-2-58:2004被替代
Environmental Testing - Part 2-58: Tests - Test Td - Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Nederlands Normalisatie Instituut
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基本信息
标准编号： NEN EN IEC 60068-2-58:2004
发布时间：2004/10/1 0:00:00
标准类别：Standard
出版单位：Nederlands Normalisatie Instituut
标准页数：24
标准简介
Provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. It also specifies standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
替代本标准的新标准
等同采用的国际标准
IEC 60068-2-58 Ed. 3.0 - Identical
