NF EN 60068-2-58:2005被替代
Environmental Testing - Part 2-58: Tests - Test Td - Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Association Francaise de Normalisation
专家解读视频
Describes Test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It also provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Indice de classement: C20-758. PR NF EN 60068 2-58 November 2002. (12/2002) Supersedes NFC 20 758 (02/2005)
SS EN 60068-2-58 Ed. 2 (2004) - Identical
EN 60068-2-58:2015 - Identical
SS EN 60068-2-58 Ed. 3 (2015) - Identical
SN EN 60068-2-58:1999 - Identical
BS EN 60068-2-58:2004 - Identical
DIN EN 60068-2-58 (2005-03) - Identical
IEC 60068-2-58 Ed. 3.0 - Identical
I.S. EN 60068-2-58:2004 - Identical
UNE EN 60068-2-58:2006 - Identical
