IEC 60068-2-58 Ed. 2.0被替代
Environmental testing Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60068-2-58 Ed. 2.0
发布时间：1999/1/1 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：17
标准简介
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
替代本标准的新标准
