NFC 20 758:1990被替代
Environmental Testing - Test Td: Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Association Francaise de Normalisation
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基本信息
标准编号： NFC 20 758:1990
发布时间：1990/2/1 0:00:00
标准类别：Standard
出版单位：Association Francaise de Normalisation
标准页数：14
标准简介
The object of this test is to provide a standard procedure for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens). The procedure uses a solder bath and is applicable only to specimens of products designed to withstand short-term immersion in molten solder.
替代本标准的新标准
等同采用的国际标准
IEC 60068-2-58 Ed. 3.0 - Identical
