DIN EN 60068-2-58 (2005-03)被替代
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
This standard is included in DIN DVS Handbook 196, 196/2. Describes Test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It also provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Supersedes DIN IEC 60068-2-58 & DIN IEC 50-390-CDV. (11/1999) Supersedes DIN 45598. (03/2005) DRAFT 2011 issued in July 2011. (08/2011)
IEC 60068-2-58 Ed. 3.0 - Identical
NF EN 60068-2-58:2005 - Identical
BS EN 60068-2-58:2004 - Identical
EN 60068-2-58:2015 - Identical
SS EN 60068-2-58 Ed. 3 (2015) - Identical
NF EN 60068-2-58:2015 - Identical
SN EN 60068-2-58:1999 - Identical
I.S. EN 60068-2-58:2004 - Identical
UNE EN 60068-2-58:2006 - Identical
SS EN 60068-2-58 Ed. 2 (2004) - Identical
