
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版:Asociacion Espanola de Normalizacion

专家解读视频
Describes Test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It also provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Supersedes UNE 20501-2-58. (08/2003)
SS EN 60068-2-58 Ed. 2 (2004) - Identical
I.S. EN 60068-2-58:2004 - Identical
IEC 60068-2-58 Ed. 3.0 - Identical
NF EN 60068-2-58:2005 - Identical
DIN EN 60068-2-58 (2005-03) - Identical
BS EN 60068-2-58:2004 - Identical
SN EN 60068-2-58:1999 - Identical
NF EN 60068-2-58:2015 - Identical
EN 60068-2-58:2015 - Identical
DIN EN 60068-2-58:2016 - Identical
SS EN 60068-2-58 Ed. 3 (2015) - Identical
BS EN 60068-2-58:2015 - Identical
NF EN 60068-2-58 : 2015 - Identical
DIN EN 60068-2-58 : 2016 - Identical
I.S. EN 60068-2-58:2015 - Identical
SN EN 60068-2-58 : 1999 - Identical
BS EN 60068-2-58 : 2015 - Identical
IEC 60068-2-58 : 4.1 - Identical
BS EN 60068-2-58 : 2015 - Identical
NF EN 60068-2-58 : 2015 - Identical
DIN EN 60068-2-58 : 2016 - Identical
SN EN 60068-2-58 : 1999 - Identical
I.S. EN 60068-2-58:2015 - Identical