
Semiconductor devices. Mechanical and climatic test methods. Bond strength
出版:British Standards Institution

专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits). Measures bond strength or determine compliance with specified bond strength requirements.
© British Standards Institution 2013
EN 60749-22:2003 - Identical
IEC 60749-22 Ed. 1.0 - Identical
SN EN 60749-22:2003 - Identical
DIN EN 60749-22 (2003-12) - Identical
NBN EN 60749-22:2004 - Identical
NF EN 60749-22:2003 - Identical
I.S. EN 60749-22:2003 - Identical
UNE EN 60749-22:2004 - Identical
SS EN 60749-22 Ed. 1 (2004) - Identical
IEC 60749-22 : 1.0 - Identical
NBN EN 60749-22 : 2004 - Identical
I.S. EN 60749-22:2003 - Identical
DIN EN 60749-22 : 2003 - Identical
EN 60749-22 : 2003 - Identical
NF EN 60749-22 : 2003 - Identical
UNE EN 60749-22 : 2004 - Identical
SN EN 60749-22 : 2003 - Identical
I.S. EN 60749-22:2003 - Identical
DIN EN 60749-22 : 2003 - Identical