I.S. EN 60749-22:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods Part 22: Bond Strength
出版：National Standards Authority of Ireland
专家解读视频
Pertains to semiconductor devices (discrete devices and integrated circuits). Also measure bond strength or determine compliance with specified bond strength requirements.
BS EN 60749-22 : 2003 - Identical
NBN EN 60749-22 : 2004 - Identical
DIN EN 60749-22 : 2003 - Identical
EN 60749-22 : 2003 - Identical
NF EN 60749-22 : 2003 - Identical
UNE EN 60749-22 : 2004 - Identical
SN EN 60749-22 : 2003 - Identical
BS EN 60749-22 : 2003 - Identical
DIN EN 60749-22 : 2003 - Identical
SN EN 60749-22:2003 - Identical
BS EN 60749-22:2003 - Identical
DIN EN 60749-22 (2003-12) - Identical
NBN EN 60749-22:2004 - Identical
NF EN 60749-22:2003 - Identical
IEC 60749-22 Ed. 1.0 - Identical
SS EN 60749-22 Ed. 1 (2004) - Identical
UNE EN 60749-22:2004 - Identical
EN 60749-22:2003 - Identical
