IEC 60749-22 Ed. 1.0现行
Semiconductor devices - Mechanical and climatic test methods Part 22: Bond strength
出版：International Electrotechnical Committee
专家解读视频
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
EN 60749-22:2003 - Identical
UNE EN 60749-22:2004 - Identical
SS EN 60749-22 Ed. 1 (2004) - Identical
PN EN 60749-22:2006 - Identical
I.S. EN 60749-22:2003 - Identical
CEI EN 60749-22 Ed. 1 (2004) - Identical
SN EN 60749-22:2003 - Identical
BS EN 60749-22:2003 - Identical
DIN EN 60749-22 (2003-12) - Identical
NF EN 60749-22:2003 - Identical
NEN EN IEC 60749-22:2003 - Identical
OVE/ONORM EN 60749-22:2004 - Identical
