IEC 60749-22 : 1.0现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
出版：International Electrotechnical Committee
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determines compliance with specified bond strength requirements.
CEI EN 60749-22 : 2004 - Identical
BS EN 60749-22 : 2003 - Identical
DIN EN 60749-22 : 2003 - Identical
NEN EN IEC 60749-22 : 2003 - Identical
PN EN 60749-22 : 2006 - Identical
DS EN 60749-22 : 2004 - Identical
