SN EN 60749-22:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 22: Bond Strength
出版：Swiss Standards
专家解读视频
Applies to semiconductor devices (discrete devices and integrated circuits). Measures bond strength or determine compliance with specified bond strength requirements.
DIN EN 60749-22 (2003-12) - Identical
BS EN 60749-22:2003 - Identical
EN 60749-22:2003 - Identical
UNE EN 60749-22:2004 - Identical
SS EN 60749-22 Ed. 1 (2004) - Identical
IEC 60749-22 Ed. 1.0 - Identical
I.S. EN 60749-22:2003 - Identical
NF EN 60749-22:2003 - Identical
NBN EN 60749-22:2004 - Identical
