国际半导体设备和材料组织 - 出版社标准列表

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标准编号	标准名称	发布部门	发布日期	状态
SEMI E186:2021	Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters	Semiconduc..	2022-04-11	现行
SEMI F117:2021	Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems	Semiconduc..	2022-04-11	现行
SEMI MF1811:2016(R2021)	Guide for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data	Semiconduc..	2022-04-11	现行
SEMI MF1535:2015(R2021)	Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance	Semiconduc..	2022-04-11	现行
SEMI F118:2021	Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components	Semiconduc..	2022-04-11	现行
SEMI D74:2021	Guide for Measuring Dimensions of Plastic Films/Substrates	Semiconduc..	2022-04-11	现行
SEMI MF1771:2016(R2021)	Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique	Semiconduc..	2022-04-11	现行
SEMI C36:2021	Specifications for Phosphoric Acid	Semiconduc..	2022-04-11	现行
SEMI M16:2021	Specification for Polycrystalline Silicon	Semiconduc..	2022-04-11	现行
SEMI M66:2010(R2021)	Test Method to Extract Effective Work Function in Oxide and High-K Gate Stacks Using the MIS Flat Band Voltage-Insulator Thickness Technique	Semiconduc..	2022-04-11	现行
SEMI F119:2021	Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution	Semiconduc..	2022-04-11	现行
SEMI MF2139:2003(R2021)	Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry	Semiconduc..	2022-04-11	现行
SEMI E183:2021	Specification for Rich Interactive Test Database (RITdb)	Semiconduc..	2022-04-11	现行
SEMI M17:2010(R2021)	Guide for a Universal Wafer Grid	Semiconduc..	2022-04-11	现行
SEMI S5:2021	Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gases	Semiconduc..	2022-04-11	现行
SEMI 3D8:2021	Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process	Semiconduc..	2022-04-11	现行
SEMI C96:2021	Test Method for Determining Density of Chemical Mechanical Planarization (CMP) Slurries	Semiconduc..	2022-04-11	现行
SEMI E184:2021	Specification for 300 mm Tape Frame FOUP Load Port	Semiconduc..	2022-04-11	现行
SEMI E185:2021	Specification for 300 mm Tape Frame FOUP	Semiconduc..	2022-04-11	现行
SEMI S2:2021	Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment	Semiconduc..	2022-04-11	现行

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国际半导体设备和材料组织 -[SEMI]