
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic-encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版:National Standards Authority of Ireland

专家解读视频
Applicable to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
UNE EN 60749-20:2004 - Identical
SS EN 60749-20 Ed. 1 (2003) - Identical
IEC 60749-20 Ed. 1.0 - Identical
NF EN 60749-20:2003 - Identical
NBN EN 60749-20:2004 - Identical
DIN EN 60749-20 (2003-12) - Identical
BS EN 60749-20:2003 - Identical