IEC 60749-9 Ed. 1.0被替代
Semiconductor devices - Mechanical and climatic test methods Part 9: Permanence of marking
出版：International Electrotechnical Committee
专家解读视频
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
OVE/ONORM EN 60749-9:2003 - Identical
NEN EN IEC 60749-9:2002 - Identical
EN 60749-9:2002 - Identical
SS EN 60749-9 Ed. 1 (2003) - Identical
PN EN 60749-9:2004 - Identical
I.S. EN 60749-9:2002 - Identical
NF EN 60749-9:2002 - Identical
BS EN 60749-9:2002 - Identical
CEI EN 60749-9 Ed. 1 (2004) - Identical
UNE EN 60749-9:2003 - Identical
DIN EN 60749-9 (2003-04) - Identical
