IEC 60749-21 Ed. 1.0被替代
Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability
出版：International Electrotechnical Committee
专家解读视频
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
CEI EN 60749-21 Ed. 1 (2005) - Identical
BS EN 60749-21:2005 - Identical
DIN EN 60749-21 (2005-06) - Identical
NF EN 60749-21:2005 - Identical
I.S. EN 60749-21:2005 - Identical
PN EN 60749-21:2007 - Identical
SS EN 60749-21 Ed. 1 (2005) - Identical
NEN EN IEC 60749-21:2005 - Identical
OVE/ONORM EN 60749-21:2005 - Identical
