NEN EN IEC 60749-21:2005被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：Nederlands Normalisatie Instituut
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基本信息
标准编号： NEN EN IEC 60749-21:2005
发布时间：2005/3/1 0:00:00
标准类别：Standard
出版单位：Nederlands Normalisatie Instituut
标准页数：20
标准简介
Defines a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
替代本标准的新标准
