DIN EN 60749-21 (2005-06)被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
Constitutes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
Supersedes DIN EN 60749 and DIN IEC 60749-21. (06/2005) DRAFT 2009 issued in October 2009. (11/2009)
SS EN 60749-21 Ed. 1 (2005) - Identical
I.S. EN 60749-21:2005 - Identical
NF EN 60749-21:2005 - Identical
NBN EN 60749-21:2007 - Identical
BS EN 60749-21:2005 - Identical
EN 60749-21:2011 - Identical
NBN EN 60749-21:2011 - Identical
IEC 60749-21 Ed. 1.0 - Identical
