NF EN 60749-21:2005被替代
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：Association Francaise de Normalisation
专家解读视频
Constitutes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
Indice de classement: C96-022-21. PR NF EN 60749-21 February 2003. (02/2003) Supersedes NF EN 60749. (06/2007)
SS EN 60749-21 Ed. 1 (2005) - Identical
IEC 60749-21 Ed. 1.0 - Identical
I.S. EN 60749-21:2005 - Identical
NBN EN 60749-21:2007 - Identical
DIN EN 60749-21 (2005-06) - Identical
BS EN 60749-21:2005 - Identical
I.S. EN 60749-21:2011 - Identical
EN 60749-21:2011 - Identical
BS EN 60749-21:2011 - Identical
NBN EN 60749-21:2011 - Identical
DIN EN 60749-21 (2012-01) - Identical
