IEC/PAS 62173 Ed. 1.0被替代
Solderability test method
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC/PAS 62173 Ed. 1.0
发布时间：2000/8/1 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：17
标准简介
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for theattachment. This test method provides optional conditions for aging and soldering for the purpose of allowing simulation of the soldering process to be used in the device application. It provides proceduresfor dip & look solderability testing of through hole, axial and surface mount devices and reflow simulated use testing for surface mount packages.
替代本标准的新标准
