DIN EN 60749-20 (2007-10)废止
Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
出版：German Institute for Standardisation (Deutsches Institut für Normung)
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