BS EN 60749-25:2003现行
Semiconductor devices. Mechanical and climatic test methods. Temperature cycling
出版：British Standards Institution
专家解读视频
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
© British Standards Institution 2013
Replaces notes:
Partially replaces BS EN 60749:1999.
SN EN 60749-25:2003 - Identical
EN 60749-25 : 2003 - Identical
NF EN 60749-25 : 2003 - Identical
DIN EN 60749-25 : 2004 - Identical
SN EN 60749-25 : 2003 - Identical
NBN EN 60749-25 : 2004 - Identical
I.S. EN 60749-25:2003 - Identical
IEC 60749-25 : 1.0 - Identical
I.S. EN 60749-25:2003 - Identical
DIN EN 60749-25 : 2004 - Identical
UNE EN 60749-25 : 2004 - Identical
DIN EN 60749-25 (2004-04) - Identical
NBN EN 60749-25:2004 - Identical
NF EN 60749-25:2003 - Identical
I.S. EN 60749-25:2003 - Identical
IEC 60749-25 Ed. 1.0 - Identical
UNE EN 60749-25:2004 - Identical
EN 60749-25:2003 - Identical
