NF EN 60749-25:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 25: Temperature Cycling
出版：Association Francaise de Normalisation
专家解读视频
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
Indice de classement: C96-022-25. (01/2004) Supersedes NF EN 60749. (06/2007)
EN 60749-25:2003 - Identical
UNE EN 60749-25:2004 - Identical
IEC 60749-25 Ed. 1.0 - Identical
I.S. EN 60749-25:2003 - Identical
NBN EN 60749-25:2004 - Identical
DIN EN 60749-25 (2004-04) - Identical
BS EN 60749-25:2003 - Identical
SN EN 60749-25:2003 - Identical
DIN EN 60749-25 : 2004 - Identical
I.S. EN 60749-25:2003 - Identical
BS EN 60749-25 : 2003 - Identical
DIN EN 60749-25 : 2004 - Identical
