SN EN 60749-25:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 25: Temperature Cycling
出版：Swiss Standards
专家解读视频
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
DIN EN 60749-25 (2004-04) - Identical
BS EN 60749-25:2003 - Identical
EN 60749-25:2003 - Identical
UNE EN 60749-25:2004 - Identical
I.S. EN 60749-25:2003 - Identical
NF EN 60749-25:2003 - Identical
NBN EN 60749-25:2004 - Identical
