IEC 60749-25 : 1.0现行
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
出版：International Electrotechnical Committee
专家解读视频
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
DIN EN 60749-25 : 2004 - Identical
NBR IEC 60749-25 : 2011 - Identical
BS EN 60749-25 : 2003 - Identical
I.S. EN 60749-25:2003 - Identical
PN EN 60749-25 : 2006 - Identical
NEN EN IEC 60749-25 : 2003 - Identical
CEI EN 60749-25 : 2004 - Identical
DS EN 60749-25 : 2004 - Identical
