|
标准编号 |
标准名称 |
发布部门 |
发布日期 |
状态 |
|
I.S. EN 61189-5-503:2017 |
Test Methods for Electrical Materials, Printed Board and Other Interconnection Structures and Assemblies Part 5-503: General Test Method for Materials and Assemblies - Conductive Anodic Filaments (caf) Testing of Circuit Boards |
National S.. |
2017-08-29 |
现行 |
|
I.S. EN 61188-7:2017 |
Printed Boards and Printed Board Assemblies - Design and use Part 7: Electronic Component Zero Orientation for cad Library Construction |
National S.. |
2017-07-18 |
现行 |
|
IEC 61189-5-503 Ed. 1.0 |
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
Internatio.. |
2017-05-22 |
现行 |
|
IEC 61188-7 Ed. 2.0 |
Printed boards and printed board assemblies - Design and use Part 7: Electronic component zero orientation for CAD library construction |
Internatio.. |
2017-04-10 |
现行 |
|
DIN EN 61189-5-1 (2017-04) |
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-1: General Test Methods For Materials And Assemblies - Guidance For Printed Board Assemblies (iec 61189-5-1:2016) |
German Ins.. |
2017-04-01 |
现行 |
|
DIN EN 61189-2-719 (2017-04) |
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 2-719: Test Methods For Materials For Interconnection Structures - Relative Permittivity And Loss Tangent (500 Mhz To 10 Ghz) (iec 61189-2-719:2016) |
German Ins.. |
2017-04-01 |
现行 |
|
IEC/TR 61189-3-914 Ed. 1.0 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines |
Internatio.. |
2017-03-17 |
现行 |
|
DIN EN 61249-2-43 (2017-03) |
Materials For Printed Boards And Other Interconnecting Structures - Part 2-43: Reinforced Base Materials Clad And Unclad - Non-halogenated Epoxide Cellulose Paper/woven E-glass Reinforced Laminate Sheets Of Defined Flammability (vertical Burning Test), Copper-clad For Lead-free Assembly (iec 61249-2-43:2016) |
Verband De.. |
2017-03-01 |
现行 |
|
IEC/TR 62899-250 Ed. 1.0 |
Printed electronics Part 250: Material technologies required in printed electronics for wearable smart devices |
Internatio.. |
2016-12-14 |
现行 |
|
DIN EN 61189-3-719 (2016-12) |
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 3-719: Test Methods For Interconnection Structures (printed Boards) - Monitoring Of Single Plated-through Hole (pth) Resistance Change During Temperature Cycling (iec 61189-3-719:2016) |
German Ins.. |
2016-12-01 |
现行 |
|
DIN EN 62326-20 (2016-12) |
Printed Boards - Part 20: Printed Circuit Boards For High-brightness Leds (iec 62326-20:2016) |
German Ins.. |
2016-12-01 |
现行 |
|
DIN EN 16602-70-12 (2016-12) |
Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016 |
German Ins.. |
2016-12-01 |
现行 |
|
IEC 63055 Ed. 1.0 |
Format for LSI-Package-Board Interoperable design |
Internatio.. |
2016-11-08 |
现行 |
|
I.S. EN 61189-2-719:2016 |
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 2-719: Test Methods for Materials for Interconnection Structures - Relative Permittivity and Loss Tangent (500 mhz to 10 Ghz) |
National S.. |
2016-11-01 |
现行 |
|
I.S. EN 61189-5-1:2016 |
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 5-1: General Test Methods for Materials and Assemblies - Guidance for Printed Board Assemblies |
National S.. |
2016-10-18 |
现行 |
|
IEC/TS 61189-3-301 Ed. 1.0 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB |
Internatio.. |
2016-07-28 |
现行 |
|
I.S. EN 61249-2-44:2016 |
Materials for Printed Boards and Other Interconnecting Structures Part 2-44: Reinforced Base Materials Clad and Unclad - Non-halogenated Epoxide Non-woven/woven E-glass Reinforced Laminate Sheets of Defined Flammability (vertical Burning Test), Copper-clad for Lead-free Assembly |
National S.. |
2016-07-19 |
现行 |
|
I.S. EN 61249-2-43:2016 |
Materials for Printed Boards and Other Interconnecting Structures Part 2-43: Reinforced Base Materials Clad and Unclad - Non-halogenated Epoxide Cellulose Paper/woven E-glass Reinforced Laminate Sheets of Defined Flammability (vertical Burning Test), Copper-clad for Lead-free Assembly |
National S.. |
2016-07-19 |
现行 |
|
IEC 61189-2-719 Ed. 1.0 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) |
Internatio.. |
2016-07-12 |
现行 |
|
IEC 61189-5-1 Ed. 1.0 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
Internatio.. |
2016-07-05 |
现行 |
