
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 3-719: Test Methods For Interconnection Structures (printed Boards) - Monitoring Of Single Plated-through Hole (pth) Resistance Change During Temperature Cycling (iec 61189-3-719:2016)
出版:German Institute for Standardisation (Deutsches Institut für Normung)

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