|
标准编号 |
标准名称 |
发布部门 |
发布日期 |
状态 |
|
EN 61249-4-15:2009 |
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly |
European C.. |
2020-03-10 |
现行 |
|
IEC 61249-4-15 Ed. 1.0 |
Materials for printed boards and other interconnecting structures Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly （IEC 61249-4-15:2009 ） |
Internatio.. |
2020-03-10 |
现行 |
|
UNE EN 61249-4-15:2009 |
Materials for printed boards and other interconnecting structures -- Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.) |
Asociacion.. |
2020-03-10 |
现行 |
|
IEC 61189-2:2006 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Internatio.. |
2020-03-01 |
现行 |
|
EN 61189-2:1997/A1:2000 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
European C.. |
2020-03-01 |
被替代 |
|
IEC 61189-2:1997/AMD1:2000 |
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Internatio.. |
2020-03-01 |
被替代 |
|
IEC 61189-2:1997/COR1:1997 |
Corrigendum 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Internatio.. |
2020-03-01 |
被替代 |
|
IEC 61189-2:1997 |
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Internatio.. |
2020-03-01 |
被替代 |
|
EN 61189-2:1997/corrigendum Apr. 1997 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
European C.. |
2020-03-01 |
被替代 |
|
EN 61189-2:1997/corrigendum Aug. 1997 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
European C.. |
2020-03-01 |
被替代 |
|
EN 61189-2:1997 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
European C.. |
2020-03-01 |
被替代 |
|
EN 61189-2:2006 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
European C.. |
2020-03-01 |
现行 |
|
UNE-EN 61189-2/AC:1997 |
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES. CORRIGENDUM. (Endorsed by AENOR in June of 1999.) |
Asociacion.. |
2020-03-01 |
被替代 |
|
UNE-EN 61189-2:1997 |
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES (Endorsed by AENOR in November of 1997.) |
Asociacion.. |
2020-03-01 |
被替代 |
|
UNE-EN 61189-2:1997/A1:2000 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (Endorsed by AENOR in November of 2000.) |
Asociacion.. |
2020-03-01 |
被替代 |
|
UNE EN 61189-2:2006 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January of 2007.) |
Asociacion.. |
2020-03-01 |
现行 |
|
IEC 61249-2-45 Ed. 1.0 |
Materials for printed boards and other interconnecting structures Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly |
Internatio.. |
2018-01-10 |
现行 |
|
IEC 61249-2-47 Ed. 1.0 |
Materials for printed boards and other interconnecting structures Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly |
Internatio.. |
2018-01-10 |
现行 |
|
IEC 61249-2-46 Ed. 1.0 |
Materials for printed boards and other interconnecting structures Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly |
Internatio.. |
2018-01-10 |
现行 |
|
IEC 60194-2 Ed. 1.0 |
Printed boards design, manufacture and assembly - Vocabulary Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies |
Internatio.. |
2017-12-13 |
现行 |
