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标准编号	标准名称	发布部门	发布日期	状态
I.S. EN 62326-20:2016	Printed Boards Part 20: Printed Circuit Boards for Highbrightness Leds	National S..	2016-05-31	现行
IEC 61249-2-44 Ed. 1.0	Materials for printed boards and other interconnecting structures Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly	Internatio..	2016-05-12	现行
IEC 61249-2-43 Ed. 1.0	Materials for printed boards and other interconnecting structures Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly	Internatio..	2016-05-12	现行
ASTM F1896-16	Test Method for Determining the Electrical Resistivity of a Printed Conductive Material	American S..	2016-05-01	现行
I.S. EN 61189-3-719:2016	Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3-719: Test Methods for Interconnection Structures (printed Boards) - Monitoring of Single Plated-through Hole (pth) Resistance Change During Temperature Cycling	National S..	2016-04-26	现行
DIN EN 16602-70-12 (2016-04)	Space product assurance - Design rules for printed circuit boards; English version FprEN 16602-70-12:2016	German Ins..	2016-04-01	被替代
DIN EN 62878-1-1 (2016-03)	Device Embedded Substrate - Part 1-1: Generic Specification - Test Methods (iec 62878-1-1:2015)	German Ins..	2016-03-01	现行
IEC 62899-201 Ed. 1.0	Printed electronics Part 201: Materials - Substrates	Internatio..	2016-02-25	现行
IEC 62899-202 Ed. 1.0	Printed electronics Part 202: Materials - Conductive ink	Internatio..	2016-02-25	现行
IEC 62326-20 Ed. 1.0	Printed boards Part 20: Printed circuit boards for high-brightness LEDs	Internatio..	2016-02-03	现行
I.S. EN 60599:2016	Mineral Oil-filled Electrical Equipment in Service - Guidance on the Interpretation of Dissolved and Free Gases Analysis	National S..	2016-02-02	现行
DIN EN 61189-5-503 (2016-02)	Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-503: General Test Methods For Materials And Assemblies - Conductive Anodic Filaments (caf) Testing Of Circuit Boards (iec 91/1307/cd:2015)	German Ins..	2016-02-01	现行
IEC 61189-3-913 Ed. 1.0	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs	Internatio..	2016-01-05	现行
IEC 61189-3-719 Ed. 1.0	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling	Internatio..	2016-01-05	现行
KS C IEC 61182-2:2015	Printed board assembly products ? Manufacturing description data and transfer methodology ? Part 2 : Generic requirements	Korean Sta..	2015-12-30	现行
KS C IEC 60326-3:2015	Printed boards - Part 3:Design and use of printed boards	Korean Sta..	2015-12-30	废止
KS C IEC 60326-5:2015	Printed boards - Part 5:Specification for single anddouble sided printed boards with plated-through holes	Korean Sta..	2015-12-30	废止
KS C IEC 60326-2:2015	Printed boards - Part 2:Test methods	Korean Sta..	2015-12-30	废止
KS C 6471:2015	Test methods for flexible printed wiring boards	Korean Sta..	2015-12-30	废止
IEC/TR 63017 Ed. 1.0	Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations	Internatio..	2015-12-16	现行

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