IEC 61189-3-719 Ed. 1.0现行
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
出版：International Electrotechnical Committee
专家解读视频
基本信息
标准编号： IEC 61189-3-719 Ed. 1.0
发布时间：2016/1/5 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：22
标准简介
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
